LONDON — Leading foundry Taiwan Semiconductor Manufacturing Co. Ltd. has developed iRCX, an EDA data format for interconnect modeling with TSMC's 65- and 40-nm process technologies.
EDA tools that support iRCX format will be able to receive accurate interconnect modeling data from the iRCX files developed and supported by TSMC. Interconnect-related EDA applications, including place and route, RC parasitic extraction, electromigration analysis, power integrity analysis, and electromagnetic simulation are set to benefit from iRCX, TSMC said.
The iRCX is the first of several interoperable EDA interface formats co-developed between TSMC and its design tool partners as part of the TSMC Open Innovation Platform (OIP).
Multiple EDA companies are participating in the OIP qualification program, TSMC said without revealing the names of any of them.
"TSMC is the first foundry to collaborate with multiple EDA vendors to create and qualify an interoperable interconnect modeling format that optimizes data delivery and interpretation between interconnect extraction, modeling and analysis tools and advanced process technologies," said Shauh-Teh Juang, senior director of design infrastructure marketing at TSMC, in a statement.
"This new unified EDA data format provides designers the ability to select qualified EDA tools to match their design needs, improve compliance with TSMC processes, and ensure design accuracy for first time silicon success."
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