Newsletter

EDA DesignLine  >  News

Global 'averaged' chip sales fell 28.6% in January, says SIA





Courtesy of EE Times Europe

LONDON — The three-month average of worldwide sales of semiconductors declined by 28.6 percent in January 2009 to $15.33 billion, compared to sales of $21.47 billion in January 2008, averaged on the same basis, according to the Semiconductor Industry Association (SIA), which referenced World Semiconductor Trade Statistics as its source.

The January decline was slightly less than a decline of 30 percent predicted by analyst Bruce Diesen of Carnegie Group (Oslo, Norway).

However, the decline was steeper than the 21.9 percent annual decline recorded by the SIA for December 2008 and much stepper than the 9.8 percent year-on-year decline reported by SIA for November. The slowing trend suggests that the market collapse triggered in the fourth quarter of 2008 may be starting to reach a bottom.

The SIA reports chip sales as an average of the actual sales from the current month and the two previous months. It claims the use of the moving average mitigates variations due to differences in companies' financial calendars. The averaged January sales declined by 11.9 percent from December 2008, when sales were $17.41 billion.

"Worldwide semiconductor sales in January, historically a relatively weak month for the industry, reflected a continuing erosion of consumer confidence and the effects of the global economic recession," said SIA president George Scalise, in a statement. "Sales declined across the entire range of semiconductor products, as sales of important demand drivers such as personal computers, cell phones, automobiles and consumer items remained under pressure. Inventory levels are very low and there are some signs that forward visibility is improving," Scalise concluded.

Related articles:

January chip sales seen down 30% year-on-year

SIA slashes IC outlook for 2008 to 2010

West declining faster than East in chip sales, says SIA



 






Related Content

TECH PAPER
1. FPGA Design Methods for Fast Turn Around

TECH PAPER
2. Multi-Voltage Design Flow with Olympus-SoC

TECH PAPER
3. Realizing ESL with Scalable Transaction Level Models

TECH PAPER
4. Adaptability Breeds Success in IP Development

 


 Featured Jobs
Accenture seeking Project Management Team Lead in Charlotte, NC

Accenture seeking Software Engineer in Salt Lake City, UT

Boeing Company seeking Software Engineer in Herndon, VA

Switch and Data seeking Customer Solutions Engineer in Dallas, TX

Chart Industries seeking Sr. Developer in Cleveland, OH

More jobs on EETimesCareers
 Sponsor
 CAREER CENTER
Ready to take that job and shove it?
SEARCH JOBS:

 SPONSOR

 RECENT JOB POSTINGS
For more great jobs, career related news, features and services, please visit EETimes' Career Center.